In the silver plating of copper, K[Ag(CN)2] is used instead of AgNO3. The reason is
- a thin layer of Ag is formed on Cu
- more voltage is required
- Ag+ ions are completely removed from solution
- less availability of Ag+ ions, as Cu cannot displace Ag from [Ag(CN)2]- ion.
Answer
(4) less availability of Ag+ ions, as Cu cannot displace Ag from [Ag(CN)2]- ion.
Solution
E ( Cu2+/Cu) = +0.34 V < E (Ag+/Ag) = +0.80 V, copper displaces silver from AgNO3 solution:
Cu + 2Ag+ Cu2+ + 2Ag
This gives a loose, non-adherent deposit.
In K[Ag(CN)2], silver is held in the very stable complex [Ag(CN)2]-, so the concentration of free Ag+ is very low and Cu cannot displace Ag from it.
Silver deposits slowly and only by electrolysis, giving a smooth, uniform and adherent coating.
Answer: (4)